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Appro HyperGreen Cluster - Based
on the new Intel Xeon processor
5500 series
The Appro HyperGreen™
Cluster is based on the Appro
GreenBlade™ solution
building block offering a
modular, flexible and energy-efficient
cluster architecture that
addresses today’s natural
business growth from mid to
large-scale high performance
and high-density computing
applications. The Appro products,
based on the new Intel Xeon
Processors 5500 series, boost
performance optimization by
increasing system bandwidth,
memory capacity with 8MB shared
L3 cache and improving network
traffic processing while reducing
I/O latency with outstanding
power management features.
The Appro HyperGreen Cluster
solution offers customers
performance scalability, density
and energy efficiency at a
competitive price. Its core
cluster components, cooling
fans, power supplies and blade
nodes, are hot-swappable and
redundant offering superior
reliability, availability
and serviceability. It features
up to 80 GreenBlade nodes,
totaling 640 processing cores
per 42U standard rack cabinet,
doubling the density compared
with traditional rack mounted
servers. It offers 1.0TB of
internal storage and up to
48GB of DDR3 1333MHz memory
per node. With its green design
and utilizing 90%+ efficient
power supplies, HyperGreen
Cluster boasts up to 20% |
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power consumption reduction per
node compared to 1U servers, significantly
reducing energy bills in the datacenter.
In addition, the Appro HyperGreen
Cluster solution provides flexibility
with a choice of servers, networking,
interconnects and an open commercially
supported cluster management solution
that can be easily configured and
pre-integrated as a part of a complete
package to include HPC professional
services and support.
Ideal
Environment
Addresses businesses requirements
for innovation and pre-packaged
industry standard solutions that
are simplified, easy to manage
with lower TCO and a quick path
to ROI. The Appro HyperGreen Cluster
solution is designed for mid-
to large HPC deployments scaling
up to of 1000 nodes of computing
power. It is ideal for High Performance
Computing (HPC) applications with
the need for a large memory footprint
and 64-bit software capability
such as EDA, Seismic Processing,
CAE, Life Sciences, CFD, Rendering
Seismic,Reservoir Modeling, Seismic
Reverse Time Migration, Prestack
Time/Depth Migration, Monte Carlo
and most HPC applications (eg.
Nastran, Ansys, LS-Dyna).
Intel, the Intel logo, Xeon, and
Xeon Inside are trademarks or
registered trademarks of Intel
Corporation in the U.S. and other
countries.
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